Arm TechCon 2017 Schedule

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Multiphysics Reliability Signoff for Next Generation Automotive Electronics Systems

  • Arvind Vel | Director of Product Management, ANSYS
  • Tom Quan | Deputy Director, Design Infrastructure Marketing Division, TSMC North America
Location: Ballroom B
Pass Types: All-Access Pass, Arm Mbed Connect Pass, Expo Pass, Training Pass - Get your pass now!
Track: Sponsored Sessions (Free)
Format: 50-Minute Technical Session
Audience Level: All
Recording: Not Recorded

Design for reliability is a key consideration for the successful use of next generation system-on-chips (or SoCs) in ADAS, infotainment, and other key automotive electronics systems. These SoCs manufactured on TSMC’s 16FFC process are advanced multi-core designs with significantly higher levels of integration, functionality and operating speed. These SoCs have to meet the strict requirements for automotive electronics functional safety and reliability.

ANSYS and TSMC have collaborated to define workflows that enable electromigration, thermal and ESD verification and signoff across the design chain (IP to SoC to package to system). Comprehensive multiphysics simulation that captures the various failure mechanisms and provides signoff confidence is needed to not only guarantee first time product success but also ensure compliance within regulatory limits.

This session will provide an overview of ANSYS’ chip package system reliability signoff solutions to create robust and reliable electronics systems for next generation automotive applications along with case studies based on TSMC’s N16FFC technology.